009 Multifunctional Stratified Blade Removing Glue Knife Disassemble IC kinfe Set

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Description :

Crescent Knife for A8 A9 A10 A11 A12 CPU BGA chip, crooked Knife Disassembly Cleaning Pry tool for mobile phone motherboard sealant glue, UV Glue Cleaning Tool and crooked shovel Knife for Removing the motherboard sealant glue, solder paste scraping knife for cell Phone BGA Repair and UV Glue Cleaning Tool.

Scimitar moon knife CPU NAND Baseband Edge glue Removing Cleaning Tool, mobile phone motherboard CPU NAND Baseband chip edge glue removing knife.

Features :

1. Thick knife body, thin edge, flexible material

2. Blade material flexible, soft and hard moderate
3. Handle anti-skid design, feel comfortable

Package Includes :

1 x knife handle
12 x UV glue Removing knife

BGA IC Chip Repair Knife Thin Blades CPU A7 A8 A9 A10 Motherboard Burin To Remove Phone Processors Knifes for iPhone

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Features:

1. All sorts of small chips will not a bit.

2. Break 6 s power supply IC IC, all kinds of glass does not hurt, not a bit, without risk.

3. Baseband WIFI CPU module, no risk no a bit.

4. CPU upper deflated, no risk.

5. A4 - A9 CPU without risk, dismantle all CPU upper without risk.

6. Break the A8 A9 dedicated CPU will not a bit.

7. Tin widened scraping knife, scrape one CPU can, need not repeat back and forth.

Package Included:

1 x BGA IC Chip Repair Knife Thin Blades

W101 20Pcs Mobile Phone BGA IC Chip Repair Blades Kit CPU Repair Remover Blade Cutter Phone Motherboard Chip Repair Tools

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Features: 
 

This blade adopts imported Japanese full soft SK5 super thin silicon manganese alloy sheet, which has heat resistance, low temperature resistance, oxidation resistance, corrosion resistance, good abrasion resistance and strong toughness.  

It solves many problems such as inelasticity, rust, bending and so on. 

 

Specifications: 
 

Model: W101

Material: Silicon Manganese Alloy 

Specification: 200 x 145 x 15mm/7.87 x 5.71 x 0.59" 

Weight: 265g 

 

Product uses:  
 

No.1: Dismantle all kinds of black glue small chips, do not drop point. 

No.2: Remove 6S power supply IC all kinds of glass IC, do not hurt glass, do not drop point, no risk. 

No.3: The CPU WIFI template with no risk will not drop. 

No.4: Remove CPU upper level air, no risk 

No.5: Remove all kinds of glass IC, do not hurt the glass, do not drop point, no risk. 

No.6: A4-A9CPU is not risk-free. There is no risk to remove all CPU. 

No.7: Dismantle A8 A9 CPU 

No.8: Remove all kinds of chips, scrape oil and scrape tin, soft knife does not hurt tin point. 

No.9: Scraping tin knife, scraping baseband and other chips, once and then, without repeated repeated scraping. 

No.10: Widening tin scraper, scraping CPU once, can not repeat repeated scraping. 
 

Using method and principle: first, clean the edge glue of the lower knife position and the black glue around the chip when the chip is disassembled.

Packag Included:

10 x IC Chip Repair Blades
10 x Handle

E27 5W 7W 9W 12W 15W A60 SMD5730 2835 Smart IC White 6000K No Flicker LED Globe Light Bulb AC85-265V

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Specification:

Type: A60 LED Bulb

Base: E27

Wattage: 5W/7W/9W/12W/15W

Voltage: AC85-265V

Light source: 5/7/9W ( SMD5730 ), 12/15W ( SMD2835 )
Led quantity: 10/14/18/16/20 leds
Color temperature: White 6000K
Lumen: 450lm/630lm/810lm/1080lm/1350lm
Beam angle: 120 degree

Material: PBT + Aluminum

Product size (L x H): 5W ( 50*88mm ), 7w ( 58*110mm ), 9w ( 62*125mm ), 12w ( 68*145mm ), 15w ( 78*160mm )
 

Features:

1. Reduces energy consumption up to 90%.

2. Soft light is not dazzling.

3. Universal E27 screw mouth, good conductive effect.

4. Suitable for all indoor usage - home, office or retail environment.

 

Package Included:

1*A60 LED Bulb