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Sunday, October 21, 2018

BGA IC Chip Repair Knife Thin Blades CPU A7 A8 A9 A10 Motherboard Burin To Remove Phone Processors Knifes for iPhone

BGA IC Chip Repair Knife Thin Blades CPU A7 A8 A9 A10 Motherboard Burin To Remove Phone Processors Knifes for iPhone




Features:

1. All sorts of small chips will not a bit.
2. Break 6 s power supply IC IC, all kinds of glass does not hurt, not a bit, without risk.
3. Baseband WIFI CPU module, no risk no a bit.
4. CPU upper deflated, no risk.
5. A4 - A9 CPU without risk, dismantle all CPU upper without risk.
6. Break the A8 A9 dedicated CPU will not a bit.
7. Tin widened scraping knife, scrape one CPU can, need not repeat back and forth.

Package Included:

1 x 
BGA IC Chip Repair Knife Thin Blades